Semi-intrusive brain-computer interface module realized by using silicon etching mode

The utility model relates to the technical field of brain-computer interfaces, and discloses a semi-intrusive brain-computer interface module realized in a silicon etching mode, which comprises a circuit board, a control chip and a flip chip. The circuit board can be connected with external equipment. The bottom surface of the control chip is fixedly connected with the circuit board, the top surface of the control chip is welded with the flip chip, the mode that chips in a brain-computer interface module in the prior art are arranged side by side is changed into flip arrangement, the size of the brain-computer interface module is compressed, and the signal transmission rate and reliability are improved. The control chip is circumferentially provided with a step surface recessed towards the circuit board, the step surface is provided with a first bonding pad, and the first bonding pad is electrically connected with the circuit board through a lead. One end of the flip chip is provided with an electrode which i