Semiconductor chip grabbing device

The utility model belongs to the technical field of chip processing, and more specifically relates to a semiconductor chip grabbing device. The grabbing device comprises a grabbing part and a jacking part, the jacking part comprises an ejector pin body and is used for jacking a chip to be grabbed and an elastic film at the bottom of the chip upwards, the grabbing part comprises a grabbing part cavity, the grabbing part cavity comprises a center cavity and side cavities arranged around the center cavity, and the side cavities are communicated with the center cavity. A plurality of nitrogen purging openings are formed in the top of the central cavity and are used for purging nitrogen to the front surface of the chip to be grabbed; a piston, a picking blade and a reset elastic component are arranged in the side cavity. When the semiconductor chip grabbing device works, the grabbing part is arranged on the upper portion, the jacking part is arranged on the lower portion, after the chip is jacked up by the ejector