Device for removing fallen semiconductor particles by using air knife

The utility model discloses a device for removing fallen semiconductor particles by using an air knife, which comprises a support plate, a slide rail, a power supply box, a support plate, a drawer, a left side groove and a fixing piece, a motor arranged in the power supply box is connected with a ge...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: QIAN RONGHUA, ZHU BING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a device for removing fallen semiconductor particles by using an air knife, which comprises a support plate, a slide rail, a power supply box, a support plate, a drawer, a left side groove and a fixing piece, a motor arranged in the power supply box is connected with a gear, the surface of the gear is meshed with a right side groove, the end part of the gear is connected with a first belt and a second belt, and the first belt and the second belt are arranged on the support plate. A one-way cylindrical cam is connected to the top end of the first belt, a pneumatic air knife is connected to the top end of the second belt, a connecting rod is slidably connected to the surface of the one-way cylindrical cam, and a brush is connected to the bottom face of the connecting rod. The two drawers are arranged on the inner side of the supporting plate to collect semiconductor particles, meanwhile, the motor drives the gear to rotate to synchronously drive the belt, the pneumatic air knife and