Computer host provided with dustproof structure and facilitating heat dissipation
The utility model discloses a computer mainframe with a dustproof structure and convenient for heat dissipation, which comprises a mainframe box, a case shell is fixedly connected to the side wall of one side of the mainframe box, an electrostatic adsorption net is arranged on the outer side wall of...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a computer mainframe with a dustproof structure and convenient for heat dissipation, which comprises a mainframe box, a case shell is fixedly connected to the side wall of one side of the mainframe box, an electrostatic adsorption net is arranged on the outer side wall of the case shell, a connecting plate is arranged in the mainframe box, and a dustproof structure is arranged in the connecting plate. A motor is fixedly connected to the side wall of the side, away from the case shell, of the connecting plate, a rotating rod is fixedly connected to the output end of the motor and penetrates through the connecting plate, a plurality of fan blades are fixedly connected to the side wall of the rotating rod, and a damping device is further arranged on the connecting plate. The dustproof heat dissipation structure is simple in structure, convenient to operate and capable of weakening vibration generated when the dustproof heat dissipation structure runs, so that the influence of the dust |
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