Edge surface polishing device compatible with V-groove type wafer and flat-edge type wafer

The utility model relates to the field of wafer polishing equipment, in particular to an edge surface polishing device compatible with a V-groove type wafer and a flat-edge type wafer, which comprises a first mechanism, a second mechanism, a third mechanism and a fourth mechanism, and the second mechanism acts on a wafer and is used for polishing the end face of the wafer. The polishing device has the advantages that the polishing device is divided into the first mechanism used for polishing the upper surface and the lower surface of the wafer and the second mechanism used for polishing the end face of the wafer, the upper surface and the lower surface of the wafer and the end face of the wafer are polished step by step, and the stress uniformity of the wafer in the polishing process is improved through driving effects of different degrees. The technical problem that in the prior art, stress on the wafer is not uniform in the polishing process is solved, and the technical effect that the stress on the wafer i