High-performance integrated circuit board

The utility model discloses a high-performance integrated circuit board, and relates to the field of integrated circuits. The high-performance integrated circuit board comprises an integrated board, a mounting frame and a heat dissipation air bellow, the mounting frame is fixedly clamped to the side face of the integrated board, the heat dissipation air bellow is slidably clamped between the integrated board and the mounting frame, a dust removal brush is slidably clamped to the inner side of the mounting frame, and an atomization part is fixedly arranged on the side face of the mounting frame. According to the high-performance integrated circuit board, the mounting frame is arranged on the side face of an existing integrated circuit board, the dust cleaning brush and the atomization piece are connected through the mounting frame, firstly, the passing space of airflow blown out by the cooling fan can be reduced through the blocking effect of the mounting frame, and therefore the air pressure is increased, coo