Positioning tool

The utility model discloses a positioning tool, the positioning tool is used for packaging paster solidification of an infrared detector, the infrared detector comprises a tube shell and a chip substrate, the chip substrate is fixed in the tube shell, the positioning tool comprises a positioning ass...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIU DAFU, WANG ZHEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HAND TOOLS HEATING LIGHTING MANIPULATORS MECHANICAL ENGINEERING PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS THERMAL INSULATION IN GENERAL TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING TRANSPORTING WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The utility model discloses a positioning tool, the positioning tool is used for packaging paster solidification of an infrared detector, the infrared detector comprises a tube shell and a chip substrate, the chip substrate is fixed in the tube shell, the positioning tool comprises a positioning assembly, the positioning assembly is used for positioning the tube shell, and the chip substrate is fixed in the tube shell. And the limiting assembly is arranged on the inner side of the positioning assembly, and the limiting assembly is used for preventing the chip substrate and the tube shell from generating relative movement. The positioning tool can avoid the deviation of the relative position of the chip substrate and the tube shell caused by the fluidity of glue, improves the accuracy of packaging and pasting of the infrared detector, and directly limits the position of the chip substrate, so that an operator does not need to repeatedly measure the position of the chip substrate in order to improve the accurac