Aluminum wafer stamping correction mechanism

The utility model provides an aluminum wafer stamping correction mechanism which comprises a correction seat, correction side plates are fixed on two sides of the top of the correction seat, a correction top plate is connected between the tops of the two correction side plates, a conveying roller is movably installed between the lower portions of the two correction side plates through roller shafts, one roller shaft penetrates through the correction side plates to be connected with a driven gear, and the other roller shaft penetrates through the driven gear. A driven roller is movably installed below the correction top plate, a feeding area is formed between the driven roller and the conveying roller, a fixed supporting plate is horizontally fixed to the position, in the output direction of the feeding area, of the correction base, a movable pressing plate is installed above the output end of the fixed supporting plate, and a correction assembly is installed above the input end of the fixed supporting plate.