Aluminum wafer stamping excess material cutting device

The utility model provides an aluminum wafer stamping excess material cutting device which comprises a machine tool, an upper die holder is installed at the bottom of a stamping arm of the machine tool, a lower die holder is installed on a machine table below the upper die holder, an upper die pressing plate is movably installed below the upper die holder through an upper die guide shaft, and a plurality of upper die core holes penetrating up and down are formed in the upper die pressing plate. A plurality of stamping core columns are installed at the bottom of the upper die base, the lower portions of the stamping core columns are movably inserted into the corresponding upper die core holes, the stamping core columns are movably sleeved with stripping springs, a cutting fixing plate is installed on the edge of the bottom of the upper die base in the output direction, and an excess material cutting knife is installed on the lower portion of the cutting fixing plate. And a fixed cutter is mounted on the lower