Heat dissipation printed circuit board structure

The utility model provides a heat dissipation printed circuit board structure, which comprises an upper substrate, a lower substrate and a heat dissipation device arranged on the surface of the upper substrate, the bottom of the upper substrate is provided with a first groove, the upper substrate is connected with the lower substrate and forms a cavity through the first groove, the side wall of the first groove is also uniformly provided with a plurality of second grooves, and the second grooves are arranged in the cavity. A plurality of heat conduction water pipes are placed in the cavity, the two ends of each heat conduction water pipe extend out of the cavity, a heat dissipation device is further installed on the surface of the upper substrate, each heat conduction water pipe comprises a water inlet end, a water outlet end and a heat conduction section which are integrally arranged, and sealed connector sleeves are further arranged between the water inlet end and the water outlet end. The radiating device