Water-cooling heat dissipation structure and high-power servo driver heat dissipation assembly

The utility model relates to the technical field of electronic equipment cooling parts, in particular to a water-cooling heat dissipation structure and a high-power servo driver heat dissipation assembly, which comprise a water-cooling plate and a fin radiator, the water-cooling plate comprises a heat-conducting substrate and a bottom plate, the heat-conducting substrate and the bottom plate enclose to form a space capable of accommodating the fin radiator, and the fin radiator is arranged in the space. The heat conduction substrate and the bottom plate are welded into a whole, a water inlet and a water outlet are further formed in the heat conduction substrate, a water flow channel is formed in the bottom plate, the upper surface of the fin radiator is attached to the heat conduction substrate, the lower surface of the fin radiator is arranged in the water flow channel of the bottom plate, and the fin radiator is communicated with the water inlet and the water outlet. Water flows through the water inlet, the