Packaging structure for chip
The utility model discloses a packaging structure for a chip. The packaging structure comprises a substrate, a first bonding pad, a second bonding pad, a first light-emitting chip and a second light-emitting chip. The substrate comprises a first bonding pad fixing position and a second bonding pad f...
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| Hauptverfasser: | , , , , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a packaging structure for a chip. The packaging structure comprises a substrate, a first bonding pad, a second bonding pad, a first light-emitting chip and a second light-emitting chip. The substrate comprises a first bonding pad fixing position and a second bonding pad fixing position. The first bonding pad is arranged on the first bonding pad fixing position. The first bonding pad part is provided with a first light-emitting position, and the second bonding pad part is provided with a second light-emitting position. The second bonding pad is arranged on the second bonding pad fixing position, and a third light-emitting position is arranged on the second bonding pad. The first light-emitting chip is arranged on the first bonding pad through the first light-emitting position and the second light-emitting position. The second light-emitting chip is arranged on the second bonding pad through the third light-emitting position. The first light-emitting chip is arranged through the firs |
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