Novel experiment hole plate of double-sided via-hole-free separated bonding pad

The utility model relates to a novel double-sided via-hole-free separated bonding pad experiment hole plate, which comprises a hole plate, the upper surface of the hole plate is provided with a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, and the first bondi...

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1. Verfasser: GAN YUZHENG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The utility model relates to a novel double-sided via-hole-free separated bonding pad experiment hole plate, which comprises a hole plate, the upper surface of the hole plate is provided with a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, and the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad are horizontally and vertically distributed on the hole plate. According to the utility model, the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad are arranged on the two side surfaces of the hole plate, and the bonding pads on the two side surfaces of the hole plate are not communicated with each other, so that the arrangement of elements and the utilization of the size of the whole space on the hole plate are more flexible in the use process, and the requirements of placing the elements and wiring on the two surfaces can be met; and the applicability is higher. 本申请涉及一种新型双面无过孔分离式焊盘的实验洞洞板,包括洞