PCB (Printed Circuit Board) positioning and metal bottom plate heat dissipation device of heating patch element

The utility model belongs to the technical field of PCB (printed circuit board) positioning, and particularly relates to a PCB positioning and metal bottom plate heat dissipation device of a heating patch element, which adopts the technical scheme that the PCB positioning and metal bottom plate heat...

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Bibliographische Detailangaben
Hauptverfasser: SHEN ANHU, LI QIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model belongs to the technical field of PCB (printed circuit board) positioning, and particularly relates to a PCB positioning and metal bottom plate heat dissipation device of a heating patch element, which adopts the technical scheme that the PCB positioning and metal bottom plate heat dissipation device comprises a PCB, the heating patch element is fixedly mounted at the bottom end of the PCB, a metal shell bottom plate is arranged below the PCB, a trapezoidal connecting block is fixedly mounted on the metal shell bottom plate, and the trapezoidal connecting block is fixedly connected with the metal shell bottom plate. A second sliding groove is formed in the metal shell bottom plate, a sliding groove is formed in the metal shell bottom plate, a locking bolt is movably connected in the sliding groove, a positioning column is movably connected between the PCB and the metal shell bottom plate, and a through hole is formed in the positioning column. The locking bolt has a 360-degree clamping effec