Vacuum reflow soldering with positioning structure

The vacuum reflow soldering with the positioning structure comprises a main body, a pull rod and a clamping plate, an operation screen is installed on the left side of the top end of the main body, a dustproof plate is arranged above the operation screen, a clamping block is fixed to the bottom end of the dustproof plate, a clamping groove is formed in the outer wall of the top end of the operation screen, and a clamping groove is formed in the outer wall of the top end of the clamping groove. A cooling chamber is arranged at the front end of the main body, a fan is arranged in the cooling chamber, and a hydraulic air cylinder is installed on the upper portion of the right side of the main body. According to the vacuum reflow soldering device with the positioning structure, the storage frame at the top end of the hydraulic air cylinder can be driven to move when the hydraulic air cylinder stretches out and draws back automatically, the storage frame is used for storing objects needing to be machined, and afte