Plastic metallization oscillator unit and communication equipment
The utility model discloses a plastic metallization oscillator unit, which is characterized in that a first supporting column and an oscillator side wall are respectively and directly connected with an antenna metal floor, so that a first metal layer, the first supporting column, the oscillator side...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a plastic metallization oscillator unit, which is characterized in that a first supporting column and an oscillator side wall are respectively and directly connected with an antenna metal floor, so that a first metal layer, the first supporting column, the oscillator side wall and the antenna metal floor jointly form a resonant cavity; the formed resonant cavity effectively isolates surface current crosstalk between the oscillators and between the arrays, and the first metal layer, the first supporting column, the second supporting column and the oscillator side wall are the integrally formed plastic metallization substrate, so that the whole plastic substrate can be manufactured in an electroplating manner; the process steps of laser etching, deplating, re-electroplating and the like are avoided, the production cost is greatly reduced, meanwhile, mutual coupling between the arrays is reduced, and the isolation degree between the arrays is improved.
本实用新型公开一种塑料金属化振子单元,通过将第一支撑柱和振子侧墙 |
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