Vacuum plating winding prevention overturning tool for semiconductor laser production
The utility model discloses a vacuum anti-winding plating turnover tool for semiconductor laser production, which comprises a supporting mechanism, a loading clamp mechanism and a turnover mechanism, the supporting mechanism is connected with the loading clamp mechanism and the turnover mechanism, a...
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| creator | GU YANLIANG ZHOU XUYAN CHENG SHICONG CHEN WENHE |
| description | The utility model discloses a vacuum anti-winding plating turnover tool for semiconductor laser production, which comprises a supporting mechanism, a loading clamp mechanism and a turnover mechanism, the supporting mechanism is connected with the loading clamp mechanism and the turnover mechanism, and the turnover mechanism can turn over the loading mechanism by 180 degrees to facilitate double-sided coating of a substrate. The fixture has the advantages that the fixture can be overturned by 180 degrees through the overturning mechanism, double-sided coating on a substrate is facilitated, the power of a semiconductor laser chip is improved, the service life of the semiconductor laser chip is prolonged, operation is simple, and the production cost is reduced.
本申请公开了一种半导体激光器生产用真空防绕镀翻转工装，包括支撑机构、载物夹具机构和翻转机构，支撑机构连接载物夹具机构和翻转机构，翻转机构可将载物机构翻转180°，便于对基底进行双面镀膜。具有以下优点：能够通过翻转机构将夹具翻转180°，便于对基底进行双面镀膜，提高了半导体激光器芯片功率和寿命，操作简单，降低了生产成本。 |
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本申请公开了一种半导体激光器生产用真空防绕镀翻转工装，包括支撑机构、载物夹具机构和翻转机构，支撑机构连接载物夹具机构和翻转机构，翻转机构可将载物机构翻转180°，便于对基底进行双面镀膜。具有以下优点：能够通过翻转机构将夹具翻转180°，便于对基底进行双面镀膜，提高了半导体激光器芯片功率和寿命，操作简单，降低了生产成本。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DEVICES USING STIMULATED EMISSION ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211221&DB=EPODOC&CC=CN&NR=215251149U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211221&DB=EPODOC&CC=CN&NR=215251149U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GU YANLIANG</creatorcontrib><creatorcontrib>ZHOU XUYAN</creatorcontrib><creatorcontrib>CHENG SHICONG</creatorcontrib><creatorcontrib>CHEN WENHE</creatorcontrib><title>Vacuum plating winding prevention overturning tool for semiconductor laser production</title><description>The utility model discloses a vacuum anti-winding plating turnover tool for semiconductor laser production, which comprises a supporting mechanism, a loading clamp mechanism and a turnover mechanism, the supporting mechanism is connected with the loading clamp mechanism and the turnover mechanism, and the turnover mechanism can turn over the loading mechanism by 180 degrees to facilitate double-sided coating of a substrate. The fixture has the advantages that the fixture can be overturned by 180 degrees through the overturning mechanism, double-sided coating on a substrate is facilitated, the power of a semiconductor laser chip is improved, the service life of the semiconductor laser chip is prolonged, operation is simple, and the production cost is reduced.
本申请公开了一种半导体激光器生产用真空防绕镀翻转工装，包括支撑机构、载物夹具机构和翻转机构，支撑机构连接载物夹具机构和翻转机构，翻转机构可将载物机构翻转180°，便于对基底进行双面镀膜。具有以下优点：能够通过翻转机构将夹具翻转180°，便于对基底进行双面镀膜，提高了半导体激光器芯片功率和寿命，操作简单，降低了生产成本。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EOwiAURVkcjPoPxL0D1Q7OTU0nJ3FtCH01JPQ9Ao_6-0LiBzidnJt79kK_jM15lcEbdviWH4dzZYiwAbIjlLRB5Byxzkzk5UJRJlidJZyz5WLeJIiloeqlOYrdYnyC048Hcb4Pz35sINAEKRgLCDz1j1Z1bafU9ab15a_TFwqfO2s</recordid><startdate>20211221</startdate><enddate>20211221</enddate><creator>GU YANLIANG</creator><creator>ZHOU XUYAN</creator><creator>CHENG SHICONG</creator><creator>CHEN WENHE</creator><scope>EVB</scope></search><sort><creationdate>20211221</creationdate><title>Vacuum plating winding prevention overturning tool for semiconductor laser production</title><author>GU YANLIANG ; ZHOU XUYAN ; CHENG SHICONG ; CHEN WENHE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN215251149UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>GU YANLIANG</creatorcontrib><creatorcontrib>ZHOU XUYAN</creatorcontrib><creatorcontrib>CHENG SHICONG</creatorcontrib><creatorcontrib>CHEN WENHE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GU YANLIANG</au><au>ZHOU XUYAN</au><au>CHENG SHICONG</au><au>CHEN WENHE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Vacuum plating winding prevention overturning tool for semiconductor laser production</title><date>2021-12-21</date><risdate>2021</risdate><abstract>The utility model discloses a vacuum anti-winding plating turnover tool for semiconductor laser production, which comprises a supporting mechanism, a loading clamp mechanism and a turnover mechanism, the supporting mechanism is connected with the loading clamp mechanism and the turnover mechanism, and the turnover mechanism can turn over the loading mechanism by 180 degrees to facilitate double-sided coating of a substrate. The fixture has the advantages that the fixture can be overturned by 180 degrees through the overturning mechanism, double-sided coating on a substrate is facilitated, the power of a semiconductor laser chip is improved, the service life of the semiconductor laser chip is prolonged, operation is simple, and the production cost is reduced.
本申请公开了一种半导体激光器生产用真空防绕镀翻转工装，包括支撑机构、载物夹具机构和翻转机构，支撑机构连接载物夹具机构和翻转机构，翻转机构可将载物机构翻转180°，便于对基底进行双面镀膜。具有以下优点：能够通过翻转机构将夹具翻转180°，便于对基底进行双面镀膜，提高了半导体激光器芯片功率和寿命，操作简单，降低了生产成本。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DEVICES USING STIMULATED EMISSION DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Vacuum plating winding prevention overturning tool for semiconductor laser production |
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