Vacuum plating winding prevention overturning tool for semiconductor laser production

The utility model discloses a vacuum anti-winding plating turnover tool for semiconductor laser production, which comprises a supporting mechanism, a loading clamp mechanism and a turnover mechanism, the supporting mechanism is connected with the loading clamp mechanism and the turnover mechanism, and the turnover mechanism can turn over the loading mechanism by 180 degrees to facilitate double-sided coating of a substrate. The fixture has the advantages that the fixture can be overturned by 180 degrees through the overturning mechanism, double-sided coating on a substrate is facilitated, the power of a semiconductor laser chip is improved, the service life of the semiconductor laser chip is prolonged, operation is simple, and the production cost is reduced. 本申请公开了一种半导体激光器生产用真空防绕镀翻转工装，包括支撑机构、载物夹具机构和翻转机构，支撑机构连接载物夹具机构和翻转机构，翻转机构可将载物机构翻转180°，便于对基底进行双面镀膜。具有以下优点：能够通过翻转机构将夹具翻转180°，便于对基底进行双面镀膜，提高了半导体激光器芯片功率和寿命，操作简单，降低了生产成本。