Silicon wafer heating degumming device

The utility model discloses a silicon wafer heating and degumming device which comprises a mounting frame, the top of the mounting frame is fixedly connected with a second motor, the top of the mounting frame is movably connected with a threaded rod, one end of an output shaft of the second motor penetrates through the mounting frame and is fixed with the threaded rod, one side of the threaded rod is movably connected with a movable seat, and the movable seat is movably connected with the mounting frame. A connecting shaft is movably connected to one side of the moving seat, a scraper blade is fixedly connected to one side of the connecting shaft, one end of the connecting shaft penetrates through the moving seat and is fixedly connected with a rotating wheel, and an annular clamping groove is formed in one side of the rotating wheel. According to the glue scraping device, glue on silicon wafers can be scraped by rotating the scraping plate at different angles through the rotating wheel, the working efficienc