Temperature control device for thermal stress in mold manufacturing

The utility model discloses a temperature control device for thermal stress in mold manufacturing, which belongs to the field of temperature control and comprises a fixed box, a lifting mechanism is arranged in the fixed box, a base is fixedly connected to the top of the lifting mechanism, a tempera...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LI ZONGGUO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The utility model discloses a temperature control device for thermal stress in mold manufacturing, which belongs to the field of temperature control and comprises a fixed box, a lifting mechanism is arranged in the fixed box, a base is fixedly connected to the top of the lifting mechanism, a temperature sensor is fixedly sleeved on one side of the top of the base, and the temperature sensor is connected with the lifting mechanism. The top of the base is movably sleeved with a mold shell, and one side of the mold shell is fixedly connected with a fixing block. By arranging the temperature sensor, when the temperature of the mold shell is too low, the temperature sensor is started, so that the temperature sensor converts the temperature in the mold shell into a temperature signal and inputs the temperature signal into the controller through the output end, and the controller controls the electric heating ring to start and heat the mold shell; thus, the temperature value in the mold shell reaches the required he