Sapphire wafer edging and cooling device

The utility model discloses a sapphire wafer edging cooling device which comprises a liquid storage pool and a circulating device, a slope is arranged at the right end of the bottom wall in the liquid storage pool, a groove and a chip collecting groove are sequentially formed in the upper side wall...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: PENG AIGUO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The utility model discloses a sapphire wafer edging cooling device which comprises a liquid storage pool and a circulating device, a slope is arranged at the right end of the bottom wall in the liquid storage pool, a groove and a chip collecting groove are sequentially formed in the upper side wall of the slope from left to right, the groove and the chip collecting groove are adjacent and equal in length, inserting grooves are formed in the front and back opposite side walls in the liquid storage pool, and the circulating device is arranged in the inserting grooves. The two inserting grooves and the groove are located on the same straight line and communicate with each other, a filter plate is inserted into the inserting grooves in an up-down sliding mode, the bottom of the filter plate is located in the groove, a plurality of first springs are connected between the bottom wall of the filter plate and the bottom wall of the groove, and connecting plates are connected to the front side wall and the rear side w