High-frequency module and communication device

Provided are a compact high-frequency module and a communication device with simplified manufacturing processes. A high-frequency module (1) is provided with: a module substrate (91) having main surfaces (91a, 91b) facing each other; and a first circuit component and a second circuit component, the module substrate (91) including, in a plan view of the main surface (91b), a recessed region (91R) having, as a bottom surface, a main surface (91c) recessed from the main surface (91b) toward the main surface (91a), and a protruding region (91S) located on an outer periphery of the recessed region (91R). A via conductor (95v) extending in a direction perpendicular to the main surface (91b) and having one end exposed to the main surface (91b) is disposed in the convex region (91S), a first circuit component is disposed on the main surface (91a), and a second circuit component is disposed on the main surface (91c) of the concave region (91R). 提供一种制造工序被简化的小型的高频模块和通信装置。高频模块(1)具备：模块基板(91)，其具有彼此相向的主面(91a及91b)；以及第一电路部件和第