Connecting conductive cloth applied to conduction of FPC and IC

The utility model discloses a connection conductive fabric applied to conduction of an FPC and an IC, comprising a conductive fabric body, the conductive fabric body is composed of a base material film, a release adhesive layer, a front insulation adhesive layer, a copper foil layer, a connection in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIE WEILIAN, ZHENG QINGHUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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