Connecting conductive cloth applied to conduction of FPC and IC
The utility model discloses a connection conductive fabric applied to conduction of an FPC and an IC, comprising a conductive fabric body, the conductive fabric body is composed of a base material film, a release adhesive layer, a front insulation adhesive layer, a copper foil layer, a connection in...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a connection conductive fabric applied to conduction of an FPC and an IC, comprising a conductive fabric body, the conductive fabric body is composed of a base material film, a release adhesive layer, a front insulation adhesive layer, a copper foil layer, a connection insulation adhesive layer and a shielding film, the shapes of the base material film, the release adhesive layer, the front insulation adhesive layer and the copper foil layer are matched, and the shielding film is arranged on the front insulation adhesive layer. First fit contact ends and second fit contact ends are formed on the two sides of the lower ends of the four parts, and fit concave parts are formed in the middles of the two sides of the four parts; the inner side face of the base material film is covered with a release adhesive layer, one side face of the copper foil layer is connected with a front insulation adhesive layer in a covering mode, the top end of the copper foil layer extends out of the top end |
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