Bonding structure surface acoustic wave device with continuous sound velocity

The utility model discloses a bonding structure surface acoustic wave device with continuous sound velocity, which relates to the field of surface acoustic wave devices and sequentially comprises a supporting substrate, a buffer layer, a component gradient layer, a piezoelectric substrate and an int...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU ZHIBIN, LU ZENGTIAN, FENG QIONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
Online-Zugang:	Volltext bestellen
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