Bonding structure surface acoustic wave device with continuous sound velocity
The utility model discloses a bonding structure surface acoustic wave device with continuous sound velocity, which relates to the field of surface acoustic wave devices and sequentially comprises a supporting substrate, a buffer layer, a component gradient layer, a piezoelectric substrate and an int...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a bonding structure surface acoustic wave device with continuous sound velocity, which relates to the field of surface acoustic wave devices and sequentially comprises a supporting substrate, a buffer layer, a component gradient layer, a piezoelectric substrate and an interdigital transducer from bottom to top, the component resistivity of one side of the component gradient layer close to the buffer layer is larger than that of one side of the component gradient layer close to the piezoelectric substrate, and the component resistivity of the other side of the component gradient layer close to the piezoelectric substrate is larger than that of the component gradient layer close to the interdigital transducer. The component sound velocity of the side, close to the buffer layer, of the component gradient layer is higher than the component sound velocity of the side, close to the piezoelectric substrate, of the component gradient layer, and components linearly change in the growth dire |
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