Vacuum chuck for wafer processing and automatic thinning machine

The utility model relates to the technical field of wafer processing, in particular to a vacuum chuck for wafer processing. A vacuum chuck for wafer processing comprises a chuck, a base and a sealing ring, and the sealing ring is arranged between the chuck and the base. The vacuum chuck is used for sucking the wafer, and meanwhile, the heating temperature control system is used for heating the blue film or the white film of the to-be-processed object, so that the viscosity of the blue film or the white film is reduced, the white film or the blue film is easy to tear off, the wafer discharging efficiency is improved, and the wafer breaking rate is reduced. The utility model also provides an automatic thinning machine used for wafer processing. The automatic thinning machine comprises the vacuum chuck. 本实用新型涉及晶圆加工技术领域，尤其涉及一种用于晶圆加工的真空吸盘。一种用于晶圆加工的真空吸盘，包括吸盘、底座和密封圈，密封圈设置在吸盘与底座之间。利用真空吸盘吸住晶圆，同时利用加热控温系统对待加工物的蓝膜或白膜加热,降低蓝膜或白膜的粘性，使得撕去白膜或蓝膜更为容易，提高下片效率、降低破片率。本实用新型还提供一种用于晶圆加工的自动减薄机，所述自动减薄机包括所述真空吸盘。