Wafer high-precision thickness grinding online control equipment

The utility model discloses wafer high-precision thickness grinding on-line control equipment which comprises a grinding device body, a sealing door, a lead screw, an initial picture, a processing pressure standby picture, a virtual grinding device and an equipment adjusting device. The output end of the crystal thickness setting unit is connected with the input end of the controller module, and the output end of the crystal thickness setting unit is connected with the input end of the controller module, so that the thickness of a grinding wafer can be set through manual input, and information conditions can be respectively transmitted to the control unit and the sensor amplifier unit through the controller module; grinding information conditions are processed through first measurement processing through a control unit, the information is transmitted to a data synthesis module through a first instruction sending module, intelligent adjustment can be conducted on the grinding information conditions through set