Partition plate type heat dissipation structure

The utility model relates to the technical field of chip heat dissipation, in particular to a partition plate type heat dissipation structure, which comprises an upper cover module, a lower cover module and a test module, and is characterized in that the upper cover module comprises a cover plate, first heat dissipation modules symmetrically arranged on two sides below the cover plate, and a second heat dissipation module arranged between the two first heat dissipation modules; the lower cover module comprises a frame, third heat dissipation modules symmetrically arranged on the two sides of the frame, and a fan arranged on the rear side of the frame. The test module is arranged in a hollow cavity formed by fixedly connecting the lower cover module and the upper cover module; the test module comprises a signal analysis module fixed in the frame, an electric control module arranged on the rear side of the signal analysis module, and a pressing plate module arranged above the signal analysis module. According t