Light source conversion chip packaging mechanism plate for laser radar

The utility model provides a light source conversion chip packaging mechanism plate for a laser radar, and relates to the technical field of packaging equipment, the light source conversion chip packaging mechanism plate comprises a bottom plate, the top of the bottom plate is respectively and fixedly provided with an L-shaped frame A, a workbench, a metal frame, a supporting frame and an L-shaped frame B. When the position is in butt joint with a packaging shell, the height is adjusted, an electromagnetic plate is disconnected, and the L-shaped frame A is connected with the workbench. In the whole packaging process of the device, the device does not make contact with the human hand from transportation to operation, pollution caused by fingerprints and dust brought in when people move is reduced, the problem that in the manual packaging process of an existing device, the performance of a chip is reduced due to the influence of the fingerprints and external dust is solved, the height of a movable plate is adju