Uniform cutting device for integrated circuit chip production
The utility model discloses a uniform cutting device for integrated circuit chip production. The uniform cutting device comprises a bottom plate, two sets of supporting legs are fixedly connected to the bottom face of the bottom plate, a control panel is fixedly connected to the front face of the bo...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a uniform cutting device for integrated circuit chip production. The uniform cutting device comprises a bottom plate, two sets of supporting legs are fixedly connected to the bottom face of the bottom plate, a control panel is fixedly connected to the front face of the bottom plate, a single-chip microcomputer is fixedly connected to the bottom face of the bottom plate, and a servo motor is fixedly connected to the upper surface of the bottom plate. According to the chip cutting device, a chip can be cut through the laser cutting mechanism, the servo motor can be stopped through the single-chip microcomputer and the servo motor when the photoelectric sensor senses the chip, it is ensured that the cutting length of the chip is controlled every time, thrust can be provided for the pressing plate in cooperation with the air cylinder, the pressing plate can clamp the chip, and therefore the chip can be conveniently cut. According to the chip cutting device, the chip is prevented from i |
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