Waterproof structure of PCB

The utility model relates to a waterproof structure of a PCB (Printed Circuit Board), which comprises a surrounding plate and a resin layer, the surrounding plate surrounds the peripheral side of the vertically arranged PCB, the resin layer covers the PCB, and the resin layer is propped against the...

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Bibliographische Detailangaben
Hauptverfasser:	XU PEIQIN, HE LIQIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	The utility model relates to a waterproof structure of a PCB (Printed Circuit Board), which comprises a surrounding plate and a resin layer, the surrounding plate surrounds the peripheral side of the vertically arranged PCB, the resin layer covers the PCB, and the resin layer is propped against the inner wall of the peripheral side of the surrounding plate. The waterproof performance of the PCB can be improved. 本申请涉及一种PCB板的防水结构，其包括围设在呈竖直设置的PCB板周侧的围板和覆盖在PCB板上的树脂层，且所述树脂层抵接在围板的周侧内壁上。本申请有助于提高PCB板的防水性能。