Device for improving welding flatness of photosensitive chip

The utility model belongs to the technical field of surface mounting, and relates to a device for improving the welding flatness of a photosensitive chip, which is used for assisting a chip body to be welded on a welding disc surface of a printed circuit board, and comprises a parallel supporting block and a balancing weight, the parallel supporting block is arranged on the lower surface of the chip body and is arranged on the same side with a solder ball of the chip body, and the balancing weight is arranged on the lower surface of the chip body. The lower surface of the parallel supporting block is parallel to the upper surface of the chip body, a contact disc used for supporting the parallel supporting block is arranged on the welding disc face of the printed circuit board, and the balancing weight is used for being placed on the upper surface of the chip body during welding so that the parallel supporting block can be attached to the contact disc. According to the utility model, the upper surface of the w