Sensor packaging structure
The utility model relates to the technical field of sensors, and provides a sensor packaging structure. According to the sensor packaging structure provided by the embodiment of the utility model, pressure is applied to the pressure sensor through the flexible shell, the hollow cavity is arranged in...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of sensors, and provides a sensor packaging structure. According to the sensor packaging structure provided by the embodiment of the utility model, pressure is applied to the pressure sensor through the flexible shell, the hollow cavity is arranged in the flexible shell, and the bulge and the groove which are opposite to each other are arranged in the cavity, so that when the flexible shell is stressed to deform, the bulge is extruded in the groove, and the pressure sensor is prevented from being damaged. The pressing force is conducted to the sensing end of the pressure sensing chip, and the stress of the sensing end is uniformly dispersed through embedding of the protrusion and the groove.
本实用新型涉及传感器技术领域,提供一种传感器封装结构。本实用新型实施例的传感器封装结构,通过柔性外壳对压力传感器施加压力,通过于柔性外壳的内部设置中空的腔体,并于腔体中设置位置相对的凸起和凹槽,当柔性外壳受力形变时,凸起被挤压于凹槽内,使得按压力传导至压力传感芯片的感应端,通过凸起与凹槽的镶嵌,使得感应端的受力分散均匀。 |
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