Vacuum packaging LED device

The utility model discloses a vacuum packaging LED device which comprises a concave support, an LED chip and an optical element. The LED chip is fixed at the bottom of the inner side of the concave bracket; an electrode of the LED chip is connected with an electrode of the concave bracket; step structures are arranged on the inner sides of the two protruding end portions of the concave support, metal layers are prefabricated on the step structures, the optical element is arranged on the step structures in an attached mode, and solder layers are arranged at the attached positions of the two end portions of the optical element and the step structures. The concave support and the optical element are packaged to form a vacuum closed space, and the metal layer and the solder layer are combined to form an eutectic layer. According to the utility model, packaging is carried out in a vacuum environment, so that the interior of the device is in a vacuum environment, device bursting caused by air expansion in the devic