Frequency conversion multifunctional chip packaging structure

The utility model discloses a frequency conversion multifunctional chip packaging structure, and belongs to the technical field of chip packaging. The variable-frequency multifunctional chip packaging structure comprises a fixing plate, a fixing assembly is arranged in the fixing plate, the fixing assembly comprises a pressing rod, a supporting plate and a limiting plate, springs are fixedly connected to the bottom of the limiting plate, iron wires are fixedly connected to the four sides of the limiting plate, elastic rods are hinged to the bottom ends of the iron wires, and the elastic rods are fixedly connected to the pressing rod. Fixing rods are fixedly connected to the four corners in the fixing plate, blocking rods are hinged to the interiors of the fixing rods, torsional springs are arranged on the outer sides of the blocking rods, and one ends of the torsional springs are fixedly connected with the fixing rods. According to the variable-frequency multifunctional chip packaging structure, the chip body