Fan-out package of high-frequency multi-chip module

The utility model discloses a fan-out type package of a high-frequency multi-chip module, which comprises a plastic package layer in which a plurality of chips are plastically packaged, pins of the chips are exposed on the surface of the plastic package layer, a rewiring layer for leading out the pins of the chips is arranged on one side of the plastic package layer corresponding to the pins of the chips, and solder balls are arranged on one side, far away from the plastic package layer, of the rewiring layer. The surfaces of the chips plastically packaged in the plastic packaging layer and the surface of the rewiring layer are coated with a photosensitive organic dielectric layer, a plurality of uniformly distributed dotted annular gaps are formed in the photosensitive organic dielectric layer around each chip, the dotted annular gaps are filled with copper, a copper layer is arranged on the upper surface of the photosensitive organic dielectric layer, and the copper layer is arranged on the lower surface of