Quad flat no-lead (QFN) integrated module and lead frame
The utility model discloses a QFN (Quad Flat No-lead) integrated module, which comprises a pin frame and three groups of MOS (Metal Oxide Semiconductor) tube assemblies, wherein the pin frame comprises a first bonding pad on which a first input pin is formed, three second bonding pads, three output...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a QFN (Quad Flat No-lead) integrated module, which comprises a pin frame and three groups of MOS (Metal Oxide Semiconductor) tube assemblies, wherein the pin frame comprises a first bonding pad on which a first input pin is formed, three second bonding pads, three output pins and a second input pin; any two of the first bonding pad and the three second bonding pads are arranged at intervals. The MOS tube assembly comprises a first MOS tube and a second MOS tube; the drain electrode of the first MOS tube is electrically connected with the first bonding pad; the source electrode of the second MOS tube is electrically connected with the corresponding second input pin; the source electrode of a first MOS tube and the drain electrode of a second MOS tube of the MOS tube assembly are connected and then are electrically connected with the corresponding output pins; each first MOS tube and each second MOS tube are electrically connected with a control pin; according to the utility model, m |
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