Aluminum wire bonding structure of high-power solid relay

The utility model discloses an aluminum wire bonding structure of a high-power solid-state relay, which comprises a ceramic copper-clad plate, a bonding area A and a bonding area B are arranged on the ceramic copper-clad plate, the bonding area A and the bonding area B are electrically connected thr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHAO DULIANG, GONG JINGJING, ZHANG CHAOQUN, XIA NIAN, TANG CHUNHUA, LIU LIXIANG, HE XUEDONG, WEN RENJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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