Aluminum wire bonding structure of high-power solid relay

The utility model discloses an aluminum wire bonding structure of a high-power solid-state relay, which comprises a ceramic copper-clad plate, a bonding area A and a bonding area B are arranged on the ceramic copper-clad plate, the bonding area A and the bonding area B are electrically connected through bonding of a bonding wire A. One end of the bonding wire A is bonded with a first bonding point on the upper end face of the bonding area A, and the other end of the bonding wire B is bonded with a second bonding point on the lower end face of the bonding area B. The other end of the bonding wire A is bonded with a second bonding point on the upper end face of the bonding area A. One end of the bonding wire B is bonded with the second bonding point, and the other end of the bonding wire B is bonded on the bonding area B. The bonding structure is simple in structure and high in practicability, and not only can reduce on-resistance, but also can improve bonding reliability. 本实用新型公开了一种大功率固体继电器的铝丝键合结构，它包括陶瓷覆铜板，陶瓷覆