Resin substrate and electronic device

The utility model provides a resin substrate and electronic equipment. The resin substrate is provided with: a resin body; an interlayer connection conductor formed on the resin body; a conductor pattern bonded to the interlayer connection conductor; a first resin layer having a first coefficient of thermal expansion; and a second resin layer having a second coefficient of thermal expansion, the resin body having: a void formed in the vicinity of a joint portion where the interlayer connecting conductor and the conductor pattern are connected; and a contact portion in contact with the interlayer connection conductor, the first coefficient of thermal expansion being greater than the second coefficient of thermal expansion, the void being formed in the first resin layer, and the contact portion being formed in the second resin layer. 本实用新型提供一种树脂基板以及电子设备。树脂基板具备：树脂体；层间连接导体，形成于所述树脂体；导体图案，与所述层间连接导体接合；第1树脂层，具有第1热膨胀系数；和第2树脂层，具有第2热膨胀系数，所述树脂体具有：空隙，形成在所述层间连接导体以及所述导体图案的接合部的附近；和接触部，与所述层间连接导体接触，所述第1热膨胀系数大于所述第2热膨胀系数，所述空隙形成在