SMD vehicle-mounted audio power amplifier packaging structure

The utility model relates to an SMD vehicle-mounted audio power amplifier packaging structure which comprises a plastic packaging body and a lead frame, the plastic packaging body wraps the lead frame, the lead frame comprises a frame body and a cooling fin, a chip is installed in the center of the cooling fin, and the cooling fin is provided with a circle of V-shaped isolation groove at the periphery of the chip. The frame body comprises an upper row of outer pins, a lower row of outer pins, a left welding structure and a right welding structure, the right welding structure is connected withthe rightmost outer pin in the lower row, the upper row of outer pins and the lower row of outer pins respectively comprise eighteen outer pins, bonding areas are arranged at the inner ends of the outer pins respectively, and the bonding areas of the outer pins are in bonding connection with the chip through bonding wires. The outer ends of the outer pins extend to the outer side of the plastic package body, the two weldi