Semiconductor package structure

The invention provides a semiconductor packaging structure. The semiconductor packaging structure comprises a bearing shell; the first chip is arranged on the first surface of the bearing shell, and the first chip is a flip chip and comprises a flip lug; the second chip is a flip chip and comprises a flip lug; and an adapter substrate; wherein one part of the inverted convex block of the first chip is electrically connected with the inverted convex block of the second chip, and the other part of the inverted convex block of the first chip is electrically connected with the bearing shell through the adapter substrate. The semiconductor packaging structure in the technical scheme of the utility model can effectively reduce the size and the process difficulty of the packaging structure. 本公开提供一种半导体封装结构，包括：承载壳体；第一芯片，设置于所述承载壳体的第一表面，其中，所述第一芯片为倒装芯片，包括倒装凸块；第二芯片，所述第二芯片为倒装芯片，包括倒装凸块；和转接基板；其中，所述第一芯片的一部分倒装凸块与所述第二芯片的倒装凸块电连接，所述第一芯片的另一部分倒装凸块通过所述转接基板与所述承载壳体电连接。本实用新型技术方案中的半导体封装结构可以有效减小封装结构的体积和工艺难度。