Supporting base

The present disclosure provides a support base including a support member including a resistive layer having at least two regions, a wiring layer, and a plurality of conductive vias. The resistive layer and the wiring layer are arranged in different planes of the support member and are connected by...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MARGAVIO PATRICK, BREITLOW STANTON HOPKINS, PHILLIPS BRITTANY, ENGLISH KURT, PTASIENSKI KEVIN, NOSRATI MOHAMMED, SMITH KEVIN, AMES KEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present disclosure provides a support base including a support member including a resistive layer having at least two regions, a wiring layer, and a plurality of conductive vias. The resistive layer and the wiring layer are arranged in different planes of the support member and are connected by a plurality of vias. The number of regions of the resistive layer is greater than or equal to the number of wires coupled to the wiring layer. The wiring layer may include a plurality of arm portions extending from a central region of the wiring layer. The support base may also include a second resistive layer disposed along the same plane as the wiring layer. 本公开提供了一种支撑基座,其包括支撑构件,该支撑构件包括具有至少两个区的电阻层、布线层和多个导电过孔。电阻层和布线层布置在支撑构件的不同平面中并且通过多个过孔连接。电阻层的区的数量大于或等于联接到布线层的导线的数量。布线层可包括从布线层的中心区域延伸的多个臂部分。支撑基座还可以包括沿着与布线层相同的平面布置的第二电阻层。