Semiconductor package, motor controller and new energy automobile

The utility model discloses a semiconductor packaging piece, a motor controller and a new energy automobile. The semiconductor package comprises a substrate, a first conducting strip, a second conducting strip and a third conducting strip, wherein the substrate is provided with a first metal layer and a second metal layer, the first metal layer and the second metal layer are arranged at an interval, the first metal layer and the second metal layer are arranged in an insulating manner, a first chip group is mounted on the first metal layer, and a second chip group is mounted on the second metallayer; the first conducting strip is electrically connected with the first metal layer; the second conducting strip is connected with the surface, deviating from the first metal layer, of the first chipset and is also connected with the second metal layer; and the third conducting strip is connected with the surface, deviating from the second metal layer, of the second chip group. According to the semiconductor packaging