Infrared sensor with thickened PCB substrate

The utility model provides an infrared sensor of a thickened PCB substrate, comprising a tube cap, a PCB substrate, a metal tube seat and a circuit element, a basic circuit layer is printed in the PCBsubstrate, the circuit element comprises a field effect transistor and an infrared induction unit, the PCB substrate is a thickened PCB substrate, the thickness of the PCB substrate is greater than 0.6 mm, and the thickness of the PCB substrate is greater than 0.6 mm. The infrared induction unit is directly installed on the PCB substrate. According to the utility model, the thickened PCB substrate is adopted, the distance between the infrared induction unit and the optical filter can be shortened without ferrite, and compared with the ferrite arranged on the PCB substrate, the thickened PCB substrate has a simpler structure and a simpler production process, so that the structure is simplified, the mass production is facilitated, and the production efficiency is improved. And the purposesof simplifying the process