Radio frequency power amplifier front-end chip

The utility model belongs to the technical field of chips, and particularly relates to a radio frequency power amplifier front-end chip which comprises a clamping plate, a placing plate is arranged atthe top of the clamping plate, a water cooling pipe is arranged at the top of the placing plate, a fixing column is arranged at the top of the placing plate, and a base plate is arranged at the top of the fixing column. Heat generated by a circuit chip installed on a substrate can be effectively absorbed by uniformly placing the water cooling pipes on the top of the placing plate, further, the heat treatment plate and the water cooling pipes are connected through the connector to form a loop, and water absorbing the heat enters the treatment tank, so that the heat treatment efficiency is improved. Therefore, the first rotating shaft drives the fan blades to rotate so as to discharge heat transmitted by the heat conduction shell to the outside, the heat dissipation effect of the chip is effectively improved, and t