Circuit board copper deposition plate post-plating processing device
The utility model relates to a circuit board copper deposition plate post-plating processing device which comprises a lower pressing plate, a processing template is arranged on the lower pressing plate, a corresponding hole is formed in the processing template, a grinding mechanism is arranged in th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a circuit board copper deposition plate post-plating processing device which comprises a lower pressing plate, a processing template is arranged on the lower pressing plate, a corresponding hole is formed in the processing template, a grinding mechanism is arranged in the corresponding hole, an L-shaped corresponding strip is arranged in the processing template, a supporting piece is arranged on the outer side wall of the L-shaped corresponding strip, and the supporting piece is connected with the same outer side plate. A clamping mechanism is arranged on the outerside plate, a plurality of driving motors are arranged on the outer side plate of the machining template, and the driving motors are connected with a power transmission mechanism. The corresponding holes are formed in the processing template according to the through holes in the circuit board, the polishing columns are arranged in the corresponding holes, and the linkage columns are pressed against through the movement o |
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