Wire moving mechanism of bundling machine

A wire moving mechanism of a binding machine solves the technical defect that a wire moving mechanism of an existing binding machine cannot be used for binding wires to be bound, so that the wires tobe bound are prone to loosening in the process of being transferred to the binding mechanism, and ado...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: WANG LEIQI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!