Wire moving mechanism of bundling machine
A wire moving mechanism of a binding machine solves the technical defect that a wire moving mechanism of an existing binding machine cannot be used for binding wires to be bound, so that the wires tobe bound are prone to loosening in the process of being transferred to the binding mechanism, and ado...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A wire moving mechanism of a binding machine solves the technical defect that a wire moving mechanism of an existing binding machine cannot be used for binding wires to be bound, so that the wires tobe bound are prone to loosening in the process of being transferred to the binding mechanism, and adopts the technical scheme that the wire moving mechanism comprises a rack, a workbench plate arranged on the rack, and a wire pushing assembly arranged on the workbench plate; the wire pushing assembly comprises a wire pushing plate and a wire pushing plate driving mechanism; a wire pressing assembly is arranged on the rack; the wire pressing assembly comprises more than one wire pressing plate, and each wire pressing plate is elastically hinged to the rack. When the wire pushing plate pushes the to-be-bundled wires to move to the bundling mechanism, the wire pressing plate elastically hinged to the rack automatically presses the to-be-bundled wires on the wire pushing plate elastically under the action of elastic f |
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